Film sealant and sealing method
US9127186B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 21, 2011 |
| Grant date | Sep 8, 2015 |
| Priority date | — |
| Expiry date | Sep 21, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2896
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A film sealant useful for tightly sealing an electric device at a low temperature and a sealing method of using the sealant are provided. The device is covered and sealed by covering at least a region of the device with a film sealant containing a copolyamide-series resin, heat-melting the sealant, and cooling the sealant. The copolyamide-series resin may have a melting point or softening point of 75 to 160° C. and may be a crystalline resin. The copolyamide-series resin may be a multiple copolymer or may contain a unit derived from a long-chain component having a C8-16alkylene group (e.g., a C9-17lactam and an aminoC9-17alkanecarboxylic acid). The film sealant may cover one side of the device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.