Space imaging overlay inspection method and array substrate
US9127934B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 8, 2012 |
| Grant date | Sep 8, 2015 |
| Priority date | — |
| Expiry date | May 1, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D86/021
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Embodiments of the invention discloses a space imaging overlay inspection method and an array substrate; the method comprises: forming a thin film having a space imaging overlay mark by photolithography; when the thin film is a transparent thin film, performing a color developing treatment on the space imaging overlay mark on the transparent thin film, so as to make the space imaging overlay mark appear in a non-transparent color; and conducting a space imaging overlay inspection between the transparent thin film and an adjacent thin film by using the space imaging overlay mark appear appearing in the non-transparent color. In the method, by conducting the color developing treatment to the space imaging overlay mark on the transparent thin film and then conducting positioning, the space imaging overlay mark can be positioned quickly and accurately, thus alignment condition between two photolithography procedures can be detected swiftly and effectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.