Method of compensating for effects of mechanical stresses in a microcircuit
US9127994B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 29, 2013 |
| Grant date | Sep 8, 2015 |
| Priority date | — |
| Expiry date | Aug 6, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/00
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for manufacturing an integrated circuit includes forming in a substrate a measuring circuit sensitive to mechanical stresses and configured to supply a measurement signal representative of mechanical stresses exerted on the measuring circuit. The measuring circuit is positioned such that the measurement signal is also representative of mechanical stresses exerted on a functional circuit of the integrated circuit. A method of using the integrated circuit includes determining from the measurement signal the value of a parameter of the functional circuit predicted to mitigate an impact of the variation in mechanical stresses on the operation of the functional circuit, and supplying the functional circuit with the determined value of the parameter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.