Thermally labile precursor compounds for improving the interparticulate contact sites and for filling the interstices in semiconductive metal oxide particle layers
US9129801B2 · kind B2 · utility
2Cited by
0References
15Claims
0Family size
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Key dates
| Filing date | Jun 15, 2010 |
| Grant date | Sep 8, 2015 |
| Priority date | — |
| Expiry date | Jan 7, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02628
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a process for producing a layer comprising at least one semiconductive metal oxide on a substrate, comprising at least the steps of:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.