Package structure of optical transceiver component
US9129883B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 18, 2014 |
| Grant date | Sep 8, 2015 |
| Priority date | — |
| Expiry date | Apr 21, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F77/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention provides a package structure of optical transceiver component, comprising: a metal base; a plurality of pins, at least one optical emitting diode and/or at least one optical receiving diode; wherein the pins are provided and passed through the metal base and insulated with the metal base by using an insulating material; the optical emitting diode and the optical receiving diode are each mounted on the metal base through a sub-mount, respectively. The optical emitting diode/optical receiving diode is connected to the pins neighboring therewith by a wire directly or through the sub-mount, when set the top surface of the pins be a reference level, at least one of the top surfaces of the optical emitting diode, the optical receiving diode, and sub-mount is flush with the reference level.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.