Patent · US Active

Component having a micromechanical microphone structure

US9131319B2 · kind B2 · utility

13Cited by

1References

9Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Jochen Zoellin · Memmingen, DE
Ricardo Ehrenpfordt · Gerlingen, DE
Juergen Graf · Stuttgart, DE
Christoph Schelling · Stuttgart, DE
Frederik Ante · Stuttgart, DE
Michael Curcic · Stuttgart, DE

Key dates

Filing date	Oct 4, 2013
Grant date	Sep 8, 2015
Priority date	—
Expiry date	Oct 9, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH04R2410/03
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A capacitive MEMS microphone structure is provided, which micromechanical microphone structure of component is realized in a layer construction and includes: a diaphragm structure sensitive to sound pressure, which is deflectable in a direction perpendicular to the layer planes of the layer construction; an acoustically penetrable counter-element which has through holes and is formed above or below the diaphragm structure in the layer construction; and a capacitor system for detecting the excursions of the diaphragm structure. The diaphragm structure includes a structural element in the middle area of the diaphragm structure, which structural element projects perpendicularly from the diaphragm plane and which, depending on the degree of excursion of the diaphragm structure, variably extends into a correspondingly formed and positioned through hole in the counter-element.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.