Patent · US Active

Buffer layer for sintering

US9131610B2 · kind B2 · utility

0Cited by

107References

20Claims

0Family size

Assignees

Pen Inc. · US
ISHIHARA CHEMICAL CO., LTD. · JP

Inventors

Zvi Yaniv · Austin, US
Mohshi Yang · Austin, US
Peter B. Laxton · Alameda, US

Key dates

Filing date	Nov 7, 2013
Grant date	Sep 8, 2015
Priority date	—
Expiry date	Nov 7, 2033

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49156
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A layer of material having a low thermal conductivity is coated over a substrate. A film of conductive ink is then coated over the layer of material having the low thermal conductivity, and then sintered. The film of conductive ink does not absorb as much energy from the sintering as the film of conductive ink coated over the layer of material having the low thermal conductivity. The layer of material having the low thermal conductivity may be a polymer, such as polyimide.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.