Jet impingement cooling apparatuses having enhanced heat transfer assemblies
US9131631B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 8, 2013 |
| Grant date | Sep 8, 2015 |
| Priority date | — |
| Expiry date | Mar 15, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Enhanced heat transfer assemblies and jet impingement cooling apparatuses having target surfaces with surface fins and microslots are disclosed. In one embodiment, an enhanced heat transfer assembly includes a target surface, a plurality of surface fins extending from the target surface, and a plurality of microslot matrices formed on the target surface. Each microslot matrix includes individual microslots positioned adjacent to each other, and each microslot matrix is adjacent to a jet impingement zone and at least one of the plurality of surface fins. Jet impingement cooling apparatuses and power electronics modules having an enhanced heat transfer assembly with surface fins and matrices of microslots are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.