Sensor over-mold shape
US9131858B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 31, 2012 |
| Grant date | Sep 15, 2015 |
| Priority date | — |
| Expiry date | Feb 26, 2034 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61B2562/162
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An implantable sensor module includes a housing having an inner shell and an outer layer formed to extend over and enclose the inner shell to form an outer wall of the housing, the inner shell having a thickness extending between an inner wall of the inner shell and an outer wall of the inner shell, the outer layer having an inner side engaged against the outer wall of the inner shell and having a thickness extending between the inner side and the outer wall of the housing, wherein the inner shell and the outer layer form a substantially flat portion. A flexible diaphragm is formed within the inner shell and extends between a first edge and a second edge, and a shoulder extends adjacent to the first edge to extend the outer layer laterally away from a central medial line extending between the first and second edges of the diaphragm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.