Method and apparatus for beam soldering
US9132495B2 · kind B2 · utility
0Cited by
22References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 25, 2008 |
| Grant date | Sep 15, 2015 |
| Priority date | — |
| Expiry date | Oct 29, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K1/0056
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Beam soldering involves using a beam of light emitted from a source to reflow adjoining pairs of solder pads on components being joined. In some scenarios, material between adjacent solder pads on at least one of the components is absorptive of a certain spectrum of light and, consequently, can be damaged by such spectrum of light. A beam soldering tool is configured with a filter through which the light from the light source travels to a plurality of adjoining pairs of solder pads. The filter filters out a certain spectrum of light which could otherwise be damaging to material between adjacent solder pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.