Multi-step pattern formation
US9132510B2 · kind B2 · utility
20Cited by
21References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 2, 2012 |
| Grant date | Sep 15, 2015 |
| Priority date | — |
| Expiry date | Sep 24, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49996
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
One embodiment includes a method for creating a recessed pattern in a substrate. The method includes laser ablating the substrate to form a recessed complex edge geometry in the substrate. The recessed complex edge geometry forms at least a portion of the pattern. The method also includes machining a remainder of the pattern with a mechanical cutter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.