Laser removal of conductive seed layers
US9132511B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 14, 2014 |
| Grant date | Sep 15, 2015 |
| Priority date | — |
| Expiry date | Jul 14, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/172
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Various techniques are disclosed for an apparatus and a method to remove a layer from a substrate having a pattern formed on the layer. In one example, the apparatus comprises a stage configured to receive and hold the substrate. The apparatus may further comprise an irradiating device comprising a projection lens and configured to irradiate the surface of the substrate with pulses of laser light having a selected fluence to remove an interstitial portion of the layer between the pattern without removing the pattern for corresponding irradiated areas of the substrate. The pulses of laser light may be focused through the projection lens, and the stage and the projection lens may be configured to move continuously relative each other to irradiate a plurality of areas of the substrate with the pulses of laser light.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.