Substrate defect detection mechanism
US9132665B2 · kind B2 · utility
0Cited by
1References
20Claims
0Family size
Assignee
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Key dates
| Filing date | Aug 22, 2013 |
| Grant date | Sep 15, 2015 |
| Priority date | — |
| Expiry date | Aug 22, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2203/011
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method is disclosed. The method includes one or more light field cameras recording image data of a substrate during printing to the substrate and a control unit processing the image data received from the one or more light field cameras to identify defect areas in the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.