Etching composition, method of forming a metal pattern using the etching composition, and method of manufacturing a display substrate
US9133550B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 28, 2012 |
| Grant date | Sep 15, 2015 |
| Priority date | — |
| Expiry date | Nov 6, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D86/60
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An etching composition, a method of forming a metal pattern using the etching composition, and a method of manufacturing a display substrate are disclosed. The etching composition includes about 0.1% by weight to about 25% by weight of ammonium persulfate, about 0.1% by weight to about 25% by weight of an organic acid, about 0.01% by weight to about 5% by weight of a chelating agent, about 0.01% by weight to about 5% by weight of a fluoride compound, about 0.01% by weight to about 5% by weight of a chloride compound, about 0.01% by weight to about 2% by weight of an azole-based compound and a remainder of water. Thus, a copper layer may be stably etched to improve a reliability of manufacturing the metal pattern and the display substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.