Apparatus for detecting the flatness of wafer and the method thereof
US9134122B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 27, 2013 |
| Grant date | Sep 15, 2015 |
| Priority date | — |
| Expiry date | May 6, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B11/303
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus for detecting the flatness of a top surface of a wafer includes a plurality of detector elements, a metal sink and a plurality of injection pipes. Each detector element comprises: a metal tube body, jet pipes, a light receiver and a light emitter. The method comprises: injecting ultra-pure water into the detector elements by injection pipes; emitting parallel beams along an upward-oblique direction, a preset Angle θ being formed between the beams and the vertical direction. The radiated beams above the water surface are incident on a receiver. The intensity of the beams received by the light receiver is used to calculate the height of the detecting point of the surface of the silicon wafer to determine the flatness condition of the wafer surface. The flatness of the photo-resist covered on the wafer surface can also be accurately measured by this method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.