Microactuated suspension with spring bias acting on conductive adhesive bond for improved reliability
US9135936B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 21, 2015 |
| Grant date | Sep 15, 2015 |
| Priority date | — |
| Expiry date | Mar 21, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/4826
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In an electrical connection to a microactuator in a disk drive suspension, an electrical lead is adhered to a microactuator using conductive adhesive and is also mechanically pressed up against the microactuator using a bias mechanism. The bias mechanism may be a spring finger that is welded to the suspension, or it may be a stainless steel finger that is formed integrally with the trace gimbal assembly. The resulting bias force that presses the contact against the microactuator surface reduces the small failure rate that can occur when the conductive adhesive separates from the microactuator's surface as a result of stress such as induced by thermal cycling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.