Methods for stiction reduction in MEMS sensors
US9136165B2 · kind B2 · utility
2Cited by
1References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 4, 2013 |
| Grant date | Sep 15, 2015 |
| Priority date | — |
| Expiry date | Aug 21, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method of the invention includes reducing stiction of a MEMS device by providing a conductive path for electric charge collected on a bump stop formed on a substrate. The bump stop is formed by depositing and patterning a dielectric material on the substrate, and the conductive path is provided by a conductive layer deposited on the bump stop. The conductive layer can also be roughened to reduce stiction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.