Method for fabricating a finFET in a large scale integrated circuit
US9136178B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 2, 2012 |
| Grant date | Sep 15, 2015 |
| Priority date | — |
| Expiry date | May 2, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/26586
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Systems and methods of fabricating a FinFET in large scale integrated circuit are disclosed. One illustrative method relates to a dummy gate process, wherein the fin structure is only formed in the gate electrode region by performing a photolithography process and an etching of a first dummy gate on a flat STI surface using chemical mechanical polishing, forming drain and source regions, depositing a medium dielectric layer, polishing the medium dielectric layer till the top of the first dummy gate is exposed through the chemical mechanical polishing process again, removing the dummy gate material via a dry etching and a wet etching, and continuously etching the STI dielectric layer with the hard mask formed by the medium dielectric layer, thereafter performing the deposition of real gate dielectric and gate electrode material to complete the device structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.