IC package with integrated waveguide launcher
US9136230B2 · kind B2 · utility
12Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 28, 2013 |
| Grant date | Sep 15, 2015 |
| Priority date | — |
| Expiry date | Mar 28, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09072
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
Embodiments described herein include an integrated circuit (IC) device. For example, the IC device can include a substrate configured to be coupled to a printed circuit board (PCB), an IC die attached to the substrate, and a waveguide launcher formed on the substrate. The waveguide launcher is electrically coupled to the IC die through the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.