Multilayer construction
US9136429B2 · kind B2 · utility
0Cited by
7References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 25, 2014 |
| Grant date | Sep 15, 2015 |
| Priority date | — |
| Expiry date | Aug 25, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/347
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Multilayer construction is disclosed. The multilayer construction includes a II-VI semiconductor layer and a Si3N4 layer disposed directly on the II-VI semiconductor layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.