Patent · US Active

Method of manufacturing a conductive adhesive bond assembly

US9136462B2 · kind B2 · utility

0Cited by

5References

16Claims

0Family size

Assignee

VEGA Grieshaber KG · DE

Inventors

Joern Jacob · Kirnbach, DE
Holger Gruhler · Tuningen, DE

Key dates

Filing date	Nov 22, 2011
Grant date	Sep 15, 2015
Priority date	—
Expiry date	Jan 27, 2032

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/42
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A method of manufacturing a conductive adhesive bond assembly consisting of a piezoactuator and a printed circuit board that are connected by at least one adhesive connection, with at least one electrical connection created by an electrically conductive adhesive between a first connection contact on the printed circuit board and between a second connection contact on the piezoactuator, whereby the connection contacts face in the same direction and the adhesive connection takes place through an opening in one of the components.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.