Three-dimensional microstructures
US9136575B2 · kind B2 · utility
1Cited by
44References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 15, 2014 |
| Grant date | Sep 15, 2015 |
| Priority date | — |
| Expiry date | Apr 15, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P5/183
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An apparatus comprising a first power combiner/divider network and a second power combiner/divider network. The first power combiner/divider network splits a first electromagnetic signal into split signals that are connectable to signal processor(s). The second power combiner/divider network combines processed signals into a second electromagnetic signal. The apparatus includes a three-dimensional coaxial microstructure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.