Printed circuit board and method for manufacturing the same
US9137886B2 · kind B2 · utility
3Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 11, 2013 |
| Grant date | Sep 15, 2015 |
| Priority date | — |
| Expiry date | Jul 4, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1536
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a printed circuit board which includes: a solder pad on which a solder ball is mounted; an insulator formed on the solder pad; and a protrusion formed under the insulator to support the solder ball when mounting the solder ball and can stably mount the solder ball.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.