Laminated structure, method of manufacturing laminated structure, and electronic apparatus
US9137892B2 · kind B2 · utility
13Cited by
2References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 18, 2013 |
| Grant date | Sep 15, 2015 |
| Priority date | — |
| Expiry date | Nov 23, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/30
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A laminated structure includes a first substrate, an adhesive, a graphene, and a second substrate. The adhesive is provided on a principal surface of the first substrate, and the adhesive has a storage elastic modulus of 7.2*104 Pa or more and 6.1*105 Pa or less at 23° C. The graphene is bonded to the adhesive, and the graphene has one or a plurality of layers. The second substrate is bonded to the graphene.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.