Electronic device and method of manufacturing the same
US9137926B2 · kind B2 · utility
4Cited by
2References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 13, 2012 |
| Grant date | Sep 15, 2015 |
| Priority date | — |
| Expiry date | Jun 30, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16251
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device includes: a semiconductor device; a heat-conductive resin, disposed above the semiconductor device, including a heat conductor and a resin; a linear carbon piece, disposed above the heat-conductive resin, to be thermally in contact with the heat conductor; and a heat spreader, disposed above the linear carbon piece, including a depressed portion having the heat-conductive resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.