Blister package and method of forming same
US9138378B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 6, 2011 |
| Grant date | Sep 22, 2015 |
| Priority date | — |
| Expiry date | Jul 6, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65D75/5833
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A blister package is defined for retaining product. The package is formed from a receptacle substrate having a planer sealing flange and at least one receptacle hollow for retaining product therein. A top layer is provided, covering the receptacle hollow with a portion overlapping and sealed to the sealing flange. A score pattern is formed in the top layer for promoting propagation of a tear upon forcing product from receptacle hollow against the top layer. The score pattern is defined by a plurality of rows of parallel straight lines aligned with the receptacle hollow. In addition, a plurality of spaced curved or bowed score lines are provided. The curved or bowed score lines transversely intersect the rows of straight lines above the receptacle hollow.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.