Stable tin free catalysts for electroless metallization
US9138733B2 · kind B2 · utility
2Cited by
3References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 17, 2012 |
| Grant date | Sep 22, 2015 |
| Priority date | — |
| Expiry date | Jan 11, 2033 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/38
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Catalysts which include nanoparticles of palladium metal and cellulose derivatives are used in electroless metal plating. The palladium catalysts are free of tin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.