Apparatus and method for solution coating thin layers
US9138771B2 · kind B2 · utility
1Cited by
11References
6Claims
0Family size
Assignee
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Key dates
| Filing date | May 19, 2009 |
| Grant date | Sep 22, 2015 |
| Priority date | — |
| Expiry date | Jul 12, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/13
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus and method for solution coating layers onto a substrate of an electronic device. A slot die coater in conjunction with a vacuum assist device is used in priming, coating and cleaning stations to produce thin layers having performance advantages over competing technologies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.