Method and apparatus for adhesive bond curing
US9138971B2 · kind B2 · utility
5Cited by
14References
24Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 27, 2013 |
| Grant date | Sep 22, 2015 |
| Priority date | — |
| Expiry date | May 26, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/17
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Portable apparatus for curing a part includes a wheeled frame having sliding part supports that move the part from a loading position to a curing position. A part clamping assembly is slidably mounted on the frame to apply clamping pressure to the part when the part is in the curing position in order to compact the part during a cure cycle. The clamping assembly includes a set of electrically heated shoes that heat the part to a cure temperature. A fan is provided to accelerate cool down the part after curing is complete. The heating and cooling operations are automatically performed by a programmed controller.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.