Polypropylene resin composition
US9139723B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 19, 2013 |
| Grant date | Sep 22, 2015 |
| Priority date | — |
| Expiry date | Dec 26, 2033 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/035
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polypropylene resin composition includes 1 to 30 wt % of homopolypropylene having a melt index of 2 to 6 g/10 min at 230° C. and 2.16 kg, and an isotacticity index of 97% or more, 1 to 40 wt % of homopolypropylene having a melt index of 16 to 22 g/10 min at 230° C. and 2.16 kg, and an isotacticity index of 96% or more, and 20 to 40 wt % of a glass fiber having an excellent rigidity supplementation effect as an inorganic filler for improving heat resistance, mechanical properties, and 1 to 10 wt % of denatured polypropylene as a compatibilizer maximizes compatibility of the polypropylene resin and the glass fiber, based on a total weight of the composition. The composition has excellent rigidity, short-term heat resistance, long-term heat resistance, and fusion strength, at a reduced weight and production cost.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.