Joint compound, wall assembly, and methods and products related thereto
US9140015B2 · kind B2 · utility
6Cited by
20References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2014 |
| Grant date | Sep 22, 2015 |
| Priority date | — |
| Expiry date | Sep 22, 2034 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE04F2201/01
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A kit for assembling walls and ceilings is provided. The kit comprises at least two gypsum boards, each with at least one tapered edge, and a self-drying joint compound comprising a polymeric binder and hollow spheres. Methods for wall and ceiling installation are provided as well.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.