Resist underlayer composition and process of producing integrated circuit devices using the same
US9140986B2 · kind B2 · utility
2Cited by
3References
11Claims
0Family size
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Key dates
| Filing date | Jul 2, 2012 |
| Grant date | Sep 22, 2015 |
| Priority date | — |
| Expiry date | Apr 6, 2033 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L83/06
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A resist underlayer composition includes a solvent and an organosilane condensation polymerization product, the organosilane condensation polymerization product including about 40 to about 80 mol % of a structural unit represented by the following Chemical Formula 1,
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.