Method for making electrical structure with air dielectric and related electrical structures
US9142497B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 5, 2011 |
| Grant date | Sep 22, 2015 |
| Priority date | — |
| Expiry date | Sep 18, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/308
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method has been described for making an electrical structure having an air dielectric and includes forming a first subunit including a sacrificial substrate, an electrically conductive layer including a first metal on the sacrificial substrate, and a sacrificial dielectric layer on the sacrificial substrate and the electrically conductive layer. The method further includes forming a second subunit including a dielectric layer and an electrically conductive layer thereon including the first metal, and coating a second metal onto the first metal of one or more of the first and second subunits. The method also includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate and sacrificial dielectric layer to thereby form the electrical structure having the air dielectric.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.