Thermoelectric heat pump with a surround and spacer (SAS) structure
US9144180B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 28, 2014 |
| Grant date | Sep 22, 2015 |
| Priority date | — |
| Expiry date | Oct 28, 2034 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF25D19/00
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat pump includes a SAS structure with a wall defining a first open side and a second open side. The heat pump also includes an interconnect board, enclosed within the SAS structure including openings. Thermoelectric modules are mounted on the interconnect board at the locations defined by the openings. The heat pump additionally includes a hot-side heat spreader that is in thermal contact with the first side of each thermoelectric module and a cold-side heat spreader that is in thermal contact with the second side of each thermoelectric module. The periphery of the hot-side heat spreader mechanically contacts the wall of the SAS structure at the first open side, and the periphery of the cold-side heat spreader mechanically contacts the wall of the SAS structure at the second open side such that any compression force applied to the heat pump is absorbed by the SAS structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.