Mould for soldering, arrangement of moulds, a method and a component
US9144855B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 19, 2009 |
| Grant date | Sep 29, 2015 |
| Priority date | — |
| Expiry date | Jul 10, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/249981
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The use of pre-sintered soldering plates, referred to as PSPs, frequently proceeds without a continuous, cohesive soldering connection between individual grains in the sinter material and between the sinter and base material. A process soldering of prefabricated, perforated, porous or drilled plates or porous, spongy, laminar material that, can be laid full-surfaced on a base element as a plurality of tiles or as individual porous, drilled or perforated inlay elements designed contour-close on a recess in the base material is provided. To this end, the selected plate materials can be mechanically equal to the base material or otherwise set off for the particular requirements of the component insert. The solder can be offset by specific diffusible, melting-point-lowering components. A mold that has an open, continuous porosity so that melted or fluid solder can flow through from the one surface to the other surface is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.