Apparatus for laser peening hidden surfaces
US9144861B2 · kind B2 · utility
3Cited by
0References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 3, 2012 |
| Grant date | Sep 29, 2015 |
| Priority date | — |
| Expiry date | Mar 22, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/18
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Methods, systems, and apparatuses are disclosed for laser peening hidden surfaces. In one embodiment, a laser processing pen is provided, the laser processing pen comprising: an elongated member, comprising: a laser pulse entry portion; a laser pulse exit portion, wherein the laser pulse exit portion includes at least one optical lens; and at least one tape guide capable of channeling at least a non-adhesive tape overlay in proximity of the laser pulse exit portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.