Electronic device comprising a nanotube-based interface connection layer, and manufacturing method thereof
US9145294B2 · kind B2 · utility
2Cited by
6References
11Claims
0Family size
Assignee
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Key dates
| Filing date | Jun 28, 2011 |
| Grant date | Sep 29, 2015 |
| Priority date | — |
| Expiry date | Oct 11, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device including a first region belonging to a semiconductor device having a first surface; a second region having a second surface; and an adhesion layer, set between the first and second regions, including first fibrils each having respective first and second ends. The first fibrils extend between the first and second surfaces and are fixed in a chemico-physical way to the first and second surfaces at the respective first and second ends.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.