Patent · US Active

Manufacturing methods for semiconductor devices

US9147582B2 · kind B2 · utility

1Cited by

9References

27Claims

0Family size

Assignee

First Solar, Inc. · US

Inventors

Jinbo Cao · Rexford, US
Bastiaan Arie Korevaar · Schenectady, US
George Theodore Dalakos · Niskayuna, US
Aharon Yakimov · Niskayuna, US
Scott Daniel Feldman-Peabody · Golden, US
Dalong Zhong · Shanghai, CN
Juan Carlos Rojo · New York, US

Key dates

Filing date	Dec 19, 2011
Grant date	Sep 29, 2015
Priority date	—
Expiry date	Feb 24, 2034

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P70/50
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method of manufacturing semiconductor assemblies is provided. The manufacturing method includes thermally processing a first semiconductor assembly comprising a first semiconductor layer disposed on a first support and thermally processing a second semiconductor assembly comprising a second semiconductor layer disposed on a second support. The first and second semiconductor assemblies are thermally processed simultaneously, and the first and second semiconductor assemblies are arranged such that the first semiconductor layer faces the second semiconductor layer during the thermal processing.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.