Semiconductor power converter and method of manufacturing the same
US9147673B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 12, 2013 |
| Grant date | Sep 29, 2015 |
| Priority date | — |
| Expiry date | Sep 24, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/13055
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
According to one embodiment, a semiconductor power converter includes first and second electrical conductors opposed to each other, first and second semiconductor elements joined to a first joint surface of the first electrical conductor, first and second convex electrical conductors joined to the first and second semiconductor elements, a junction joined to the first and second convex electrical conductors and a second joint surface of the second electrical conductor, power terminals, signal terminals, and an envelope sealing the constituent members. The envelope includes a flat bottom surface which extends perpendicular to the semiconductor elements and in which first and second bottom surfaces of the electrical conductors are exposed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.