Flip chip light emitting diode packaging structure
US9147809B1 · kind B1 · utility
1Cited by
2References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 14, 2015 |
| Grant date | Sep 29, 2015 |
| Priority date | — |
| Expiry date | Apr 14, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
Abstract
A flip chip light emitting diode packaging structure includes a substrate and an LED located on the substrate. The LED includes a P electrode and a N electrode. The substrate includes a first electrode and a second electrode mounted on a top surface of the substrate. The first electrode and the second electrode have a first protrusion and a second protrusion. The P electrode and the N electrode are fixed on the top surface of the first protrusion and the second protrusion through the solder. The bottom edge of the P electrode and the N electrode is beyond the top edge of the first protrusion and the second protrusion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.