Thermal carrier
US9149882B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 9, 2014 |
| Grant date | Oct 6, 2015 |
| Priority date | — |
| Expiry date | Dec 9, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/111
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and system for a preheating step of a wave soldering process. A bottom side preheater is positioned underneath a PCB and a thermal carrier is positioned adjacent the PCB. A top side heater may also be used. The PCB includes one or more through holes, and an electronic component having one or more pins is mounted on the PCB so that each pin is positioned in a corresponding through hole. The bottom side preheater directs heat to the bottom surface of the PCB, thereby heating the bottom surface via heat convection. The thermal carrier directs heated air laterally across the top surface of the PCB to increase a heat transfer at the top surface without increasing the temperature of the electronic component, thereby reducing a temperature differential between the top and bottom surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.