Platen for wafer polishing having diamond-ceramic composites
US9149904B1 · kind B1 · utility
4Cited by
18References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 13, 2014 |
| Grant date | Oct 6, 2015 |
| Priority date | — |
| Expiry date | Jun 25, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D18/0072
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A lapping platen having a working surface and an abrasive coating on the working surface. The abrasive coating comprises a plurality of individual abrasive composites adhered to the working surface with an epoxy, the abrasive composites comprising diamond particles and a ceramic matrix. The diamond particles have an average particle size of 0.1 micrometers to 3 micrometers with no particle larger than 6 micrometers. The abrasive composites have an average particle size of 15 micrometers to 100 micrometers with no particle larger than 150 micrometers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.