Patent · US Active

Heat-stabilized silicone mixture

US9150726B2 · kind B2 · utility

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1References
9Claims
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Key dates

Filing dateJan 2, 2013
Grant dateOct 6, 2015
Priority date
Expiry dateJan 2, 2033

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08J3/28
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

Curable silicone mixture containing an alkenyl-functional silicone, an Si—H functional silicone, an epoxy-functional silicone, a ferrocene, and a hydrosilylation curing catalyst, provide thermally stable silicones which are also adherent. The compositions are particularly useful for embedding power semiconductor devices.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.