Heat-stabilized silicone mixture
US9150726B2 · kind B2 · utility
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9Claims
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Key dates
| Filing date | Jan 2, 2013 |
| Grant date | Oct 6, 2015 |
| Priority date | — |
| Expiry date | Jan 2, 2033 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J3/28
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Curable silicone mixture containing an alkenyl-functional silicone, an Si—H functional silicone, an epoxy-functional silicone, a ferrocene, and a hydrosilylation curing catalyst, provide thermally stable silicones which are also adherent. The compositions are particularly useful for embedding power semiconductor devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.