Patent · US Revoked

Radiation-sensitive resin composition, method for forming resist pattern, acid generating agent and compound

US9152044B2 · kind B2 · utility

0Cited by
0References
18Claims
0Family size

Assignee

Inventor

Key dates

Filing dateSep 26, 2012
Grant dateOct 6, 2015
Priority date
Expiry dateOct 9, 2032

Classification

  • Technology area (CPC —)General

Abstract

A radiation-sensitive resin composition includes an acid generating agent to generate a compound represented by a following formula (1) by irradiation with a radioactive ray. In the formula (1), R1 represents a monovalent organic group having 1 to 20 carbon atoms. R2 represents a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms. The compound represented by the formula (1) is preferably a compound represented by a following formula (1-1). In the formula (1-1), R2 is as defined in the above formula (1). X represents an electron attractive group. R3 represents a monovalent organic group having 1 to 20 carbon atoms.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.