Fingerprint sensor packagings and methods
US9152838B2 · kind B2 · utility
8Cited by
164References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 26, 2013 |
| Grant date | Oct 6, 2015 |
| Priority date | — |
| Expiry date | Oct 1, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10151
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A fingerprint sensor which includes a conductive layer which is incorporatable within a housing adaptable for use in an electronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.