Chip device and method for manufacturing the same
US9153381B2 · kind B2 · utility
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16Claims
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Assignee
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Key dates
| Filing date | Mar 14, 2013 |
| Grant date | Oct 6, 2015 |
| Priority date | — |
| Expiry date | Jul 7, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/12
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Disclosed herein is a chip device including: a multilayer body having a hexahedral shape; an external electrode covering both distal ends of the multilayer body; and a shape maintaining material contained in the external electrode to maintain a shape of the external electrode at the time of forming the external electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.