Methods of adjusting ultrasonic bonding energy on wire bonding machines
US9153554B2 · kind B2 · utility
1Cited by
1References
21Claims
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Key dates
| Filing date | Apr 10, 2013 |
| Grant date | Oct 6, 2015 |
| Priority date | — |
| Expiry date | Apr 10, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01006
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of adjusting ultrasonic bonding energy on a wire bonding machine, the method comprising the steps of: providing a reference relationship between free air ball squash and ultrasonic bonding energy; determining an actual relationship between free air ball squash and ultrasonic bonding energy on a subject wire bonding machine; and adjusting at least one ultrasonic bonding energy setting of the subject wire bonding machine such that the actual relationship of the subject wire bonding machine is closer to the reference relationship.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.