Thermally-conductive sheet, LED mounting substrate, and LED module
US9153761B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 3, 2012 |
| Grant date | Oct 6, 2015 |
| Priority date | — |
| Expiry date | Oct 3, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/25
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention provides a thermally-conductive sheet excellent in heat dissipation properties. The thermally-conductive sheet includes a polymer matrix and a thermally-conductive filler dispersed in the polymer matrix. The present invention is a thermally-conductive sheet including a polymer matrix and non-spherical particles of a thermally-conductive filler that are dispersed in the polymer matrix. At least a part of the thermally-conductive filler particles are oriented in a thickness direction of the sheet. When a portion of the sheet where the thermally-conductive filler particles have the highest degree of orientation in the thickness direction of the sheet is defined as a center of orientation, and an axis passing through the center of orientation and perpendicular to sheet surfaces is defined as a central axis of orientation, the thermally-conductive sheet has a region where the thermally-conductive filler particles are oriented toward one point on the central axis of orientation and where the degree of orientation of the thermally-conductive filler particles in the thickness direction of the sheet decreases from the center of orientation toward a periphery of the she…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.