Optical interconnection assembly for spine-and-leaf network scale out
US9154860B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 11, 2014 |
| Grant date | Oct 6, 2015 |
| Priority date | — |
| Expiry date | Feb 24, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04Q2011/0096
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An optical interconnection assembly for a spine-and-leaf network is disclosed. The optical interconnection assembly has spine MF components and leaf MF components. The spine MF components are optically connected to spine MF components of spine switches via spine patch cords. The leaf MF components are optically connected to leaf MF components of leaf switches via leaf patch cords. An array of duplex fiber optic cables serves to optically connect every spine MF component to every leaf MF component so that every spine switch is optically connected to every leaf switch. The optical interconnection assembly facilitates network scale out without the multifiber connections having to be broken up into multiple duplex connections using duplex fiber optic cables.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.