Memory interconnect arrangement having high data transfer speed signal integrity
US9155194B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2012 |
| Grant date | Oct 6, 2015 |
| Priority date | — |
| Expiry date | Aug 1, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0245
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An arrangement having a processor electrically to, and mounted on, a portion of a surface of a motherboard. A plurality of memory cards is plugged into memory board slot type connectors on a surface of the memory card printed circuit board with the surface of the memory card printed circuit board being perpendicular to the surface of the motherboard. A right angle backplane connector has a first end disposed perpendicular to, and electrically connected to the surface of a motherboard and a second end disposed on the surface of, and electrically connected to, the memory card printed circuit board. The plurality of memory cards is parallel to the surface of the motherboard. An ejector mechanism is provided for removing the memory printed circuit board from an electrical connector receptacle mounted to the motherboard by camming action.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.